Optics: measuring and testing – Material strain analysis
Reexamination Certificate
2011-05-17
2011-05-17
Lauchman, L. G (Department: 2877)
Optics: measuring and testing
Material strain analysis
C324S754050, C324S755070, C324S750220, C073S760000
Reexamination Certificate
active
07944550
ABSTRACT:
A method of detecting local mechanical stress in integrated devices is provided, the method comprising: enabling the detection of a photovoltage difference between a scan probe device and a surface portion of an integrated device, the scan probe device being configured to deflect in response to the photovoltage difference; measuring the deflection of the scan probe device in response to the photovoltage difference between the scan probe device and the surface portion of the integrated device; and calculating a local stress level within the integrated device by determining a local work function of the surface portion of the integrated device based upon the deflection of the scan probe device.
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Bumm Lloyd
Dahayanaka Daminda
Kaszuba Philip V.
Moszkowicz Leon
Slinkman James A.
Cantor & Colburn LLP
International Business Machines - Corporation
Lauchman L. G
LeStrange Michael
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