System and method for chemical mechanical planarization

Details System and method for chemical mechanical planarization System and method for chemical mechanical planarization

2006-05-23

2006-05-23

Rose, Robert A. (Department: 3723)

Abrading

Precision device or process - or with condition responsive...

Computer controlled

C451S057000

Reexamination Certificate

active

07048607

ABSTRACT:
Generally, a method and apparatus for processing a substrate. In one embodiment, the method provides a first relative motion between at least a first substrate and a polishing material. A second relative motion is provided between at least a second substrate and the polishing material. The changing in direction of the relative motion extends the interval between conditioning procedures used to return the polishing material to a state that produces uniform polishing results.

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Birang et al. “Apparatus and Method for Chemical Mechanical Polishing with an Advanceable Polishing Sheet” U.S. Appl. No. 09/244,456, filed Feb. 4, 1999.

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