System and method for active control of etch process

Details System and method for active control of etch process System and method for active control of etch process

2006-05-30

2006-05-30

Deo, Duy-Vu N. (Department: 1765)

Adhesive bonding and miscellaneous chemical manufacture

Differential fluid etching apparatus

For liquid etchant

C156S345150, C156S345220, C156S345240, C156S345350

Reexamination Certificate

active

07052575

ABSTRACT:
A system for regulating an etch process is provided. The system includes one or more light sources, each light source directing light to one or more features and/or gratings on a wafer. Light reflected from the features and/or gratings is collected by a measuring system, which processes the collected light. The collected light is indicative of the dimensions achieved at respective portions of the wafer. The measuring system provides etching related data to a processor that determines the acceptability of the etching of the respective portions of the wafer. The system also includes one or more etching devices, each such device corresponding to a portion of the wafer and providing for the etching thereof. The processor selectively controls the etching devices to regulate etching of the portions of the wafer.

REFERENCES:
patent: 5711843 (1998-01-01), Jahns
patent: 6113733 (2000-09-01), Eriguchi et al.
patent: 6117791 (2000-09-01), Ko et al.
patent: 6483580 (2002-11-01), Xu et al.
patent: 6486492 (2002-11-01), Su

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