Substrateless package

Details Substrateless package Substrateless package

2008-09-09

2011-10-04

Clark, Jasmine (Department: 2815)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Bump leads

C257S690000, C257S693000, C257S723000, C257S724000, C257S737000, C257SE23021, C257SE23069

Reexamination Certificate

active

08030770

ABSTRACT:
Embodiments include but are not limited to apparatuses and systems including a microelectronic device including a die having an active surface, a conductive pillar formed on the active surface of the die, the conductive pillar having a side surface, and a molding material encasing the die and the conductive pillar, including covering the active surface of the die and the side surface of the conductive pillar. Methods for making the same also are described.

REFERENCES:
patent: 6063646 (2000-05-01), Okuno et al.
patent: 6998710 (2006-02-01), Kobayashi et al.
patent: 7023085 (2006-04-01), Pu
patent: 7122891 (2006-10-01), Dishongh et al.
patent: 7183191 (2007-02-01), Kinsman et al.
patent: 7202107 (2007-04-01), Fuergut
patent: 7456496 (2008-11-01), Hwee et al.
Freescale Semiconductor, Redistributed Chip Package (RCP) Technology.
Keith Gurnett, et al., Farewell to Surface Mount, Military & Aerospace Electronics, vol. 19, No. 7, Jul. 2008.

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