Substrate proximity processing housing and insert for...

Details Substrate proximity processing housing and insert for... Substrate proximity processing housing and insert for...

2007-11-13

2007-11-13

Perrin, Joseph L. (Department: 1746)

Cleaning and liquid contact with solids

Apparatus

With plural means for supplying or applying different fluids...

C134S102300, C134S902000

Reexamination Certificate

active

10817355

ABSTRACT:
An apparatus for generating a fluid meniscus to be formed on a surface of a substrate is provided including a housing where the housing includes a housing surface to be placed proximate to a substrate surface of the substrate. The housing further includes a process configuration receiving region that is surrounded by the housing surface. The apparatus also includes a process configuration insert which has an insert surface where the process configuration insert is defined to fit within the process configuration receiving region of the housing such that the insert surface and the housing surface define a proximity face that can be placed proximate to the substrate surface of the substrate.

REFERENCES:
patent: 3953265 (1976-04-01), Hood
patent: 4086870 (1978-05-01), Canavello et al.
patent: 4367123 (1983-01-01), Beck
patent: 4444492 (1984-04-01), Lee
patent: 4838289 (1989-06-01), Kottman et al.
patent: 5102494 (1992-04-01), Harvey et al.
patent: 5180431 (1993-01-01), Sugimoto et al.
patent: 5271774 (1993-12-01), Leenaars et al.
patent: 5294257 (1994-03-01), Kelly et al.
patent: 5343234 (1994-08-01), Kuehnle
patent: 5361449 (1994-11-01), Akimoto
patent: 5472502 (1995-12-01), Batchelder
patent: 5558111 (1996-09-01), Lofaro
patent: 5601655 (1997-02-01), Bok et al.
patent: 5660642 (1997-08-01), Britten
patent: 5705223 (1998-01-01), Bunkofske
patent: 5807522 (1998-09-01), Brown et al.
patent: 5830334 (1998-11-01), Kobayashi
patent: 5882433 (1999-03-01), Ueno
patent: 5893004 (1999-04-01), Yamamura
patent: 5945351 (1999-08-01), Mathuni
patent: 5975098 (1999-11-01), Yoshitani et al.
patent: 5989478 (1999-11-01), Ouellette et al.
patent: 5997653 (1999-12-01), Yamasaka
patent: 6086454 (2000-07-01), Watanabe et al.
patent: 6092937 (2000-07-01), Snodgrass et al.
patent: 6103636 (2000-08-01), Zahorik et al.
patent: 6108932 (2000-08-01), Chai
patent: 6132586 (2000-10-01), Adams et al.
patent: 6214513 (2001-04-01), Cai et al.
patent: 6230722 (2001-05-01), Mitsumori et al.
patent: 6341998 (2002-01-01), Zhang
patent: 6382861 (2002-05-01), Chen et al.
patent: 6391166 (2002-05-01), Wang
patent: 6398975 (2002-06-01), Mertens et al.
patent: 6417117 (2002-07-01), Davis
patent: 6446358 (2002-09-01), Mitsumori et al.
patent: 6474786 (2002-11-01), Percin et al.
patent: 6488040 (2002-12-01), de Larios et al.
patent: 6491764 (2002-12-01), Mertens et al.
patent: 6495005 (2002-12-01), Colgan et al.
patent: 6514570 (2003-02-01), Matsuyama et al.
patent: 6530823 (2003-03-01), Ahmadi et al.
patent: 6531206 (2003-03-01), Johnston et al.
patent: 6550988 (2003-04-01), Sugimoto et al.
patent: 6555017 (2003-04-01), Rushford et al.
patent: 6616772 (2003-09-01), De Larios et al.
patent: 6629540 (2003-10-01), Mitsumori et al.
patent: 6954993 (2005-10-01), Smith et al.
patent: 6988326 (2006-01-01), O'Donnell et al.
patent: 6988327 (2006-01-01), Garcia et al.
patent: 7000622 (2006-02-01), Woods et al.
patent: 7069937 (2006-07-01), Garcia et al.
patent: 2002/0007869 (2002-01-01), Pui et al.
patent: 2002/0020622 (2002-02-01), Hanson et al.
patent: 2002/0121290 (2002-09-01), Tang et al.
patent: 2002/0125212 (2002-09-01), Mertens et al.
patent: 2003/0091745 (2003-05-01), Yogev et al.
patent: 2003/0091754 (2003-05-01), Chihani et al.
patent: 2003/0092264 (2003-05-01), Shinji et al.
patent: 2003/0138968 (2003-07-01), Fisher et al.
patent: 2004/0060573 (2004-04-01), Woods
patent: 2004/0060581 (2004-04-01), Garcia et al.
patent: 2004/0069319 (2004-04-01), Boyd et al.
patent: 2004/0069329 (2004-04-01), de Larios et al.
patent: 2004/0136494 (2004-07-01), Lof et al.
patent: 2004/0178060 (2004-09-01), Ravkin et al.
patent: 2004/0182422 (2004-09-01), Boyd et al.
patent: 2005/0132515 (2005-06-01), Boyd et al.
patent: 2005/0139318 (2005-06-01), Woods et al.
patent: 2005/0145265 (2005-07-01), Ravkin et al.
patent: 2005/0145267 (2005-07-01), Korolik et al.
patent: 2005/0145268 (2005-07-01), Woods
patent: 2005/0148197 (2005-07-01), Woods et al.
patent: 2005/0217703 (2005-10-01), O'Donnell
patent: 2006/0064895 (2006-03-01), Garcia et al.
patent: 0 905 746 (1999-03-01), None
patent: 0 905 747 (1999-03-01), None
patent: 2003-151948 (2003-05-01), None
patent: 05837190 (1983-03-01), None
patent: 62150828 (1987-07-01), None
patent: 02280330 (1990-11-01), None
patent: 02309638 (1990-12-01), None
patent: 08277486 (1996-10-01), None
patent: 11031672 (1999-02-01), None
patent: 11350169 (1999-12-01), None
patent: WO 99/49504 (1999-03-01), None
patent: WO 99/16109 (1999-04-01), None
patent: WO 02/001613 (2002-01-01), None
patent: WO 02/32825 (2002-04-01), None
patent: WO 02/101795 (2002-12-01), None
patent: WO 2004/030051 (2004-04-01), None
patent: WO 03/014416 (2006-02-01), None
Owa et al. “Immersion lithography; its potential performance and issues”, Proceedings of the SPIE, SPIE, Bellingham, VA, US, vol. 5040, No. 1, Feb. 28, 2003, pp. 724-733, XP002294500.
Lim et al., “Atomic Layer deposition of transition metals”, Department of Chemistry and Chemical Biology, Harvard University, Nature Publishing Group, vol. 2, Nov. 2003, pp. 749-754.
ICKnowledge LLC, “Technology Backgrounder: Atomic Layer Deposition”, ICKnowledge.com, 2004, pp. 1-7.
“Chemical vapor deposition”, Wikipedia, the free encyclopedia, http://en.wikipedia.org/wiki/Chemical—vapor—deposition, 2005, p. 1-2.
Sigma-Aldrich, “Atomic Layer Deposition(ALD)”, http://www.sigmaaldrich.com/Area—of—Interest/Chemistry/Materials—Science/Thin—Films, 2005, pp. 1-2.
J.A. Britten, “A moving-zone Marangoni drying process for critical cleaning and wet processing,” Oct. 1997,Solid State Technology.

Affiliated with

Also associated with

Rating

Substrate proximity processing housing and insert for... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Substrate proximity processing housing and insert for..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Substrate proximity processing housing and insert for... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3855371