Substrate processing method and substrate processing apparatus

Semiconductor device manufacturing: process – Chemical etching – Combined with coating step

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Details

156345, 216 92, 430117, 430323, H01L 2100

Patent

active

056652003

ABSTRACT:
The present invention provides a substrate processing method including the coating step of coating a processing liquid on an object to be processed in a first processing unit of a processing chamber having first and second processing units, the step of conveying the object from the first processing unit to the second processing unit, the rinse step of rinsing an unnecessary processing liquid remaining on a peripheral portion of the object in the second processing unit to remove the unnecessary processing liquid, and the exposure step of conveying the rinsed object to an exposure apparatus to perform exposure processing for the object, wherein a time from the end of the rinse step for one object to be processed to the end of the rinse step for a next object to be processed is shorter than a time required for the exposure step for the one object.

REFERENCES:
patent: 4557785 (1985-12-01), Ohkuma

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