Semiconductor device manufacturing: process – Coating of substrate containing semiconductor region or of... – By reaction with substrate
Reexamination Certificate
2007-07-31
2007-07-31
Baumeister, B. William (Department: 2891)
Semiconductor device manufacturing: process
Coating of substrate containing semiconductor region or of...
By reaction with substrate
C438S776000, C438S769000, C438S765000, C257S309000, C257S314000, C257S064000, C257SE21193
Reexamination Certificate
active
10485410
ABSTRACT:
A method of processing a for an electronic device, comprising, at least: a nitridation step (a) of supplying nitrogen radicals on the surface of the electronic device substrate, to thereby form a nitride film on the surface thereof; and a hydrogenation step (b) of supplying hydrogen radicals to the surface of the electronic device substrate. By use of this method, it is possible to recover the degradation in the electric property of an insulating film due to a turnaround phenomenon which can occur at the time of nitriding an Si substrate, etc.
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Matsuyama Seiji
Nakanishi Toshio
Sasaki Masaru
Sugawara Takuya
Anya Igwe U.
Baumeister B. William
Crowell & Moring LLP
Tokyo Electron Limited
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