Substrate processing method and material for electronic device

Semiconductor device manufacturing: process – Coating of substrate containing semiconductor region or of... – By reaction with substrate

Reexamination Certificate

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C438S776000, C438S769000, C438S765000, C257S309000, C257S314000, C257S064000, C257SE21193

Reexamination Certificate

active

10485410

ABSTRACT:
A method of processing a for an electronic device, comprising, at least: a nitridation step (a) of supplying nitrogen radicals on the surface of the electronic device substrate, to thereby form a nitride film on the surface thereof; and a hydrogenation step (b) of supplying hydrogen radicals to the surface of the electronic device substrate. By use of this method, it is possible to recover the degradation in the electric property of an insulating film due to a turnaround phenomenon which can occur at the time of nitriding an Si substrate, etc.

REFERENCES:
patent: 4298629 (1981-11-01), Nozaki et al.
patent: 5189504 (1993-02-01), Nakayama et al.
patent: 5521127 (1996-05-01), Hori
patent: 6136690 (2000-10-01), Li
patent: 6200893 (2001-03-01), Sneh
patent: 6300664 (2001-10-01), Kuroi et al.
patent: 6338991 (2002-01-01), Zhang et al.
patent: 6372084 (2002-04-01), Hongo et al.
patent: 6450116 (2002-09-01), Noble et al.
patent: 6497783 (2002-12-01), Suzuki et al.
patent: 6551948 (2003-04-01), Ohmi et al.
patent: 6566205 (2003-05-01), Yu et al.
patent: 6750157 (2004-06-01), Fastow et al.
patent: 6756635 (2004-06-01), Yasuda et al.
patent: 2002/0073925 (2002-06-01), Noble et al.
patent: 2003/0157771 (2003-08-01), Luoh et al.
patent: 2003/0181012 (2003-09-01), Wang et al.
patent: 2003/0232491 (2003-12-01), Yamaguchi
patent: 2004/0119111 (2004-06-01), Omi et al.
patent: 60-241269 (1985-11-01), None
patent: 3-212938 (1991-09-01), None
patent: 03212938 (1991-09-01), None
patent: 4-245635 (1992-09-01), None
patent: 7-193059 (1995-07-01), None
patent: 2000-114541 (2000-04-01), None
patent: 2002-110975 (2002-04-01), None
patent: 2002-208593 (2002-07-01), None

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