Substrate processing chamber with tunable impedance

Details Substrate processing chamber with tunable impedance Substrate processing chamber with tunable impedance

1997-12-01

2000-10-24

Knode, Marian C.

Coating processes

Direct application of electrical, magnetic, wave, or...

Plasma

438758, H05H 124

Patent

active

06136388&

ABSTRACT:
A substrate processing system that includes a deposition chamber having a reaction zone, a plasma power source for forming a plasma within the reaction zone and an impedance tuner electrically coupled to the deposition chamber. When initially formed, the plasma has a first impedance level that can be adjusted by the impedance tuner to a second impedance level. In a preferred embodiment, the impedance tuner is a variable capacitor.

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