Substrate processing apparatus and substrate processing method

Details Substrate processing apparatus and substrate processing method Substrate processing apparatus and substrate processing method

2011-04-12

2011-04-12

Ghyka, Alexander G (Department: 2812)

Semiconductor device manufacturing: process

Coating of substrate containing semiconductor region or of...

By reaction with substrate

C438S710000, C438S758000, C438S789000, C257SE21170, C118S500000, C118S506000, C118S728000

Reexamination Certificate

active

07923380

ABSTRACT:
A substrate processing apparatus includes a processing chamber that processes a substrate, and a substrate placing base enclosed in the processing chamber, and a substrate transporting member that allows the substrate to wait temporarily on the substrate placing base, and exhaust holes provided so as to surround the substrate placing base, and a retracting space that allows the substrate transporting member to move in between lines each connecting the exhaust hole and an upper end of the substrate placing base and the substrate placing base.

REFERENCES:
patent: 2002/0034595 (2002-03-01), Tometsuka
patent: 2005/0170668 (2005-08-01), Park et al.
patent: A-7-127625 (1995-05-01), None
patent: A-11-111820 (1999-04-01), None
patent: A-2006-24837 (2006-01-01), None
patent: A-2006-86180 (2006-03-01), None
Aug. 30, 2010 Office Action issued in Japanese Patent Application No. 2009-179590 (with translation).

Affiliated with

Also associated with

Rating

Substrate processing apparatus and substrate processing method does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Substrate processing apparatus and substrate processing method, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Substrate processing apparatus and substrate processing method will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2683308