Adhesive bonding and miscellaneous chemical manufacture – Differential fluid etching apparatus – With workpiece support
Reexamination Certificate
2003-08-27
2010-10-12
MacArthur, Sylvia R. (Department: 1716)
Adhesive bonding and miscellaneous chemical manufacture
Differential fluid etching apparatus
With workpiece support
C118S730000, C134S113000
Reexamination Certificate
active
07811412
ABSTRACT:
A substrate processing apparatus comprises a spin chuck holding and rotating a substrate and an atmosphere blocking member, corresponding in planar shape and size to the substrate, arranged oppositely and proximately to the upper surface of the substrate and formed with a processing solution discharge port and a gas discharge port discharging a processing solution and gas to the central portion of the upper surface of the substrate respectively. The atmosphere blocking member is formed with an outer gas discharge port outside the gas discharge port in plan view for discharging the gas to the upper surface of the substrate. The outer gas discharge port is so formed on the atmosphere blocking member that an arrival position of the gas discharged from the outer gas discharge port is closer to the center of the upper surface of the substrate held by a spin base than an intermediate portion between the center and the outer peripheral edge of the upper surface. Thus provided is an apparatus capable of effectively expelling droplets remaining on the substrate before spin-drying the substrate by high-speed rotation.
REFERENCES:
patent: 5522412 (1996-06-01), Ohba et al.
patent: 5772764 (1998-06-01), Akimoto
patent: 6247479 (2001-06-01), Taniyama et al.
patent: 6514570 (2003-02-01), Matsuyama et al.
patent: 6669808 (2003-12-01), Adachi et al.
patent: 6810888 (2004-11-01), Tsuchiya et al.
patent: 6832616 (2004-12-01), Miyazaki
patent: 2002/0074020 (2002-06-01), Ono et al.
patent: 2005/0276921 (2005-12-01), Miya et al.
patent: 2006/0021636 (2006-02-01), Miya
patent: 7-22361 (1995-01-01), None
patent: 8-316190 (1996-11-01), None
patent: 11-176795 (1999-07-01), None
patent: 11-274135 (1999-10-01), None
patent: 2000-156363 (2000-06-01), None
patent: 2002-176026 (2001-06-01), None
Japanese Office Action dated Jul. 15, 2008 in Japanese counterpart application No. 2003-192898 with translation.
English translation of Abstract for Japanese Patent Application Laid Open No. 11-274135, dated: Oct. 1999.
English translation of Abstract for Japanese Patent Laid Open No. 11-176795, dated Jul. 1999.
Japanese Patent Application Laid Open No. 2002-176026 which is the counterpart, dated Jun. 2001, to U.S. Patent Application Publication No. 2002/0074020 A1.
Izumi Akira
Miya Katsuhiko
Dainippon Screen Mfg. Co,. Ltd.
MacArthur Sylvia R.
Ostrolenk Faber LLP
LandOfFree
Substrate processing apparatus and substrate processing... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Substrate processing apparatus and substrate processing..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Substrate processing apparatus and substrate processing... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-4228534