Coating apparatus – Gas or vapor deposition – Multizone chamber
Patent
1997-09-04
2000-04-25
Dang, Thi
Coating apparatus
Gas or vapor deposition
Multizone chamber
4147445, 4147446, 414935, 414937, 414939, 414941, 414217, 901 14, 901 15, 156345, B25J 2100, H01L 21302, H01L 21205
Patent
active
060539801
ABSTRACT:
A substrate processing apparatus comprises a substrate transfer section, connection modules attached to the substrate transfer section, and a first substrate transfer robot in the substrate transfer section capable of transferring substrates to the connection modules. The connection module comprises a substrate processing chamber, first and second intermediate chambers between the substrate processing chamber and the substrate transfer section. The second intermediate chamber is provided with a first substrate holder, the substrate processing chamber is provided with a second substrate holder, and the first intermediate chamber is provided with a substrate transfer device capable of mounting a plurality of the substrates held being stacked in the vertical direction by the first substrate holder, onto the second substrate holder such that the substrates are arranged side by side in the horizontal direction.
REFERENCES:
patent: 4816638 (1989-03-01), Ukai et al.
patent: 5083896 (1992-01-01), Uehara et al.
patent: 5151008 (1992-09-01), Ishida et al.
patent: 5584647 (1996-12-01), Uehara et al.
patent: 5695564 (1997-12-01), Imahashi
patent: 5713717 (1998-02-01), Cho
patent: 5766360 (1998-06-01), Sato et al.
Makiguchi Issei
Ozawa Makoto
Suda Atsuhiko
Toyoda Kazuyuki
Dang Thi
Kokusai Electric Co. Ltd.
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