Substrate polishing metrology using interference signals

Abrading – Precision device or process - or with condition responsive... – By optical sensor

Reexamination Certificate

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C451S005000, C451S028000, C451S285000

Reexamination Certificate

active

07841926

ABSTRACT:
A method of polishing a substrate includes holding the substrate on a polishing pad with a polishing head, wherein the polishing pad is supported by a platen, creating relative motion between the substrate and the polishing pad to polish a side of the substrate, generating a light beam and directing the light beam towards the substrate to cause the light beam to impinge on the side of the substrate being polished. Light reflected from the substrate is at a detector to generate an interference signal. A measure of uniformity is computed from the interference signal.

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