Substrate planarization with imprint materials and processes

Details Substrate planarization with imprint materials and processes Substrate planarization with imprint materials and processes

2009-01-08

2011-12-27

Walke, Amanda C. (Department: 1722)

Radiation imagery chemistry: process, composition, or product th

Imaging affecting physical property of radiation sensitive...

Radiation sensitive composition or product or process of making

C430S311000, C430S281100, C430S286100, C430S314000, C430S322000, C430S317000, C430S330000, C430S331000

Reexamination Certificate

active

08084185

ABSTRACT:
The present invention relates to planarization materials and methods of using the same for substrate planarization in photolithography. A planarization layer of a planarization composition is formed on a substrate. The planarization composition contains at least one aromatic monomer and at least one non-aromatic monomer. A substantially flat surface is brought into contact with the planarization layer. The planarization layer is cured by exposing to a first radiation or by baking. The substantially flat surface is then removed. A photoresist layer is formed on the planarization layer. The photoresist layer is exposed to a second radiation followed by development to form a relief image in the photoresist layer. The relief image is then transferred into the substrate.

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Titled, “Photolithography Focus Improvement by Reduction of Autofocus Radiation Transmission Into Substrate”, filed Feb. 19, 2008 U.S. Appl. No. 12/033,303.
International Application No. PCT/US10/20120—Filed Jan. 5, 2010 International Search Report and Written Opinion of the International Searching Authority—Dated Mar. 1, 2010.

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