Substrate monitoring during chemical mechanical polishing

Details Substrate monitoring during chemical mechanical polishing Substrate monitoring during chemical mechanical polishing

2006-03-07

2006-03-07

Hail, III, Joseph J. (Department: 3723)

Abrading

Precision device or process - or with condition responsive...

By optical sensor

C451S005000, C451S285000, C156S922000, 43

Reexamination Certificate

active

07008295

ABSTRACT:
Methods and apparatus for monitoring a substrate surface during chemical mechanical polishing are disclosed.

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