Substrate holder for retaining a substrate within a...

Electricity: electrical systems and devices – Electric charge generating or conducting means – Use of forces of electric charge or field

Reexamination Certificate

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C250S492200

Reexamination Certificate

active

06909588

ABSTRACT:
A wafer chuck is designed to allow the substrate to thermally deform during charged particle beam lithography. The wafer chuck includes a compliant layer disposed over an chuck body. During lithography processing the wafer is electrostatically held in contact with a flexible compliant layer and the wafer is exposed to the charged particle beam resulting in thermal deformation of the wafer. The compliant layer deforms with the substrate and allows the wafer to deform in a predictable manner.

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patent: 4920505 (1990-04-01), Suzuki
patent: 5310453 (1994-05-01), Fukasawa et al.
patent: 5452177 (1995-09-01), Frutiger
patent: 5581324 (1996-12-01), Miyai et al.
patent: 5729423 (1998-03-01), Donde et al.
patent: 5883778 (1999-03-01), Sherstinsky et al.
patent: 0692814 (1996-01-01), None
patent: 0856862 (1998-08-01), None

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