Substrate for hybrid IC, hybrid IC using the substrate and its a

Details Substrate for hybrid IC, hybrid IC using the substrate and its a Substrate for hybrid IC, hybrid IC using the substrate and its a

1989-01-04

1991-05-14

Hille, Rolf

357 51, 357 65, 357 67, 357 71, H01L 3902, H01L 2702, H01L 2348, H01L 2940

Patent

active

050160893

ABSTRACT:
A substrate for hybrid IC which comprises a substrate, a thick film resistor containing glass, formed on the substrate, and a thick film conductor at the terminal of the thick film resistor, where a means for preventing diffusion of the glass from the thick film resistor into the thick film conductor is provided between the thick film resistor and the thick film conductor has a stable resistance as a thick film microresistor and is applied to various uses such as cellular radio communication system.

REFERENCES:
patent: 4057777 (1977-11-01), Merz et al.
patent: 4139832 (1979-02-01), Yoshino et al.
patent: 4424251 (1984-01-01), Sugishita et al.
patent: 4517584 (1985-05-01), Matsushita et al.
patent: 4645948 (1987-02-01), Morris et al.
patent: 4652397 (1987-03-01), Nair
patent: 4685203 (1987-08-01), Takada
patent: 4695504 (1987-09-01), Watanabe et al.
Patent Abstracts of Japan, vol. 7, No. 166, (59-73146-English Abstract).
Patent Abstracts of Japan, vol. 12, No. 49, (62-198145-English Abstract).

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