Substrate edge detection

Details Substrate edge detection Substrate edge detection

2006-12-26

2006-12-26

Wilson, Lee D. (Department: 3723)

Abrading

Precision device or process - or with condition responsive...

By optical sensor

C451S005000, C451S008000, C451S009000, C451S010000, C451S011000, C451S041000, C451S286000, C451S287000, C451S288000

Reexamination Certificate

active

07153185

ABSTRACT:
A chemical mechanical polishing apparatus and method can use an eddy current monitoring system and an optical monitoring system. Signals from the monitoring systems can be combined on an output line and extracted by a computer. The eddy current monitoring system or the optical monitoring system can be used to determine the substrate edge. A focusing optic can be used to improve the accuracy of the optical monitoring system in detecting the edge of the substrate.

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