Semiconductor device manufacturing: process – Chemical etching – Combined with coating step
Reexamination Certificate
2006-08-29
2006-08-29
Ahmed, Shamim (Department: 1765)
Semiconductor device manufacturing: process
Chemical etching
Combined with coating step
C438S745000, C438S754000
Reexamination Certificate
active
07098136
ABSTRACT:
Embedded flush circuitry features are provided by providing a carrier foil having an electrically conductive layer therein and coating the electrically conductive layer with a dielectric material. Circuitry features are formed in the dielectric material and conductive metal is plated to fill the circuitry features.
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Patent Abstract of Japan, Application No. 09068383, Oct. 1998, Sony Corp., Manufacture of Printed Wiring Board.
Clothier Ronald
Knight Jeffrey Alan
Sebesta Robert David
Ahmed Shamim
Connolly Bove & Lodge & Hutz LLP
International Business Machines - Corporation
Steinberg William H.
Tran Binh X.
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