Structure for attaching a lead frame to a heat spreader/heat slu

Details Structure for attaching a lead frame to a heat spreader/heat slu Structure for attaching a lead frame to a heat spreader/heat slu

1995-09-19

1997-11-25

Thomas, Tom

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

With heat sink means

257783, 257790, 257796, 437209, 437217, 437220, H01L 23495, H01L 2348

Patent

active

056915675

ABSTRACT:
A method and structure for attaching a lead frame to a heat sink are provided. In one embodiment, a layer of thermally conductive, electrically insulating epoxy is formed on a heat sink and the epoxy layer is fully cured. A thermoplastic adhesive layer is formed on the epoxy layer, and the heat sink is clamped to the lead frame such that the thermoplastic layer contacts the lead frame. The thermoplastic layer is heated to its melting point and then cooled, thereby joining the heat sink and the lead frame. In a variation, a partially cured B-stage epoxy layer is used to replace the thermoplastic layer. The B-stage epoxy layer is fully cured to connect the lead frame to the heat sink.

REFERENCES:
patent: 4783428 (1988-11-01), Kalfus
patent: 5068708 (1991-11-01), Newman
patent: 5208188 (1993-05-01), Newman
Patent Abstract of JP-6-151662, Jun. 1994, Japan.

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