Structure and method of making sealed capped chips

Details Structure and method of making sealed capped chips Structure and method of making sealed capped chips

2007-11-20

2007-11-20

Cao, Phat X. (Department: 2814)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With window means

C257S704000, C257SE23011

Reexamination Certificate

active

10948976

ABSTRACT:
A method of making a plurality of sealed assemblies is provided which includes a) assembling a first element to a second element so that a bottom surface of the first element faces downwardly toward a front surface of the second element and a top surface of the first element faces upwardly away from the second element; and (b) forming ring seals surrounding regions of the front surface of the second element by introducing flowable material between the first element and the second element from the top surface of the first element through openings in the first element. A chip is provided which includes: (a) a body defining a front surface and one or more circuit elements on or within the body; (b) one or more bond pads exposed at the front surface in a bond pad region; and (c) a metallic ring exposed at the front surface, the ring substantially surrounding the bond pad region. Sealed chip assemblies are formed by sealing an array of the chips, e.g., in wafer form, to a cap element.

REFERENCES:
patent: 4825284 (1989-04-01), Soga et al.
patent: 4984358 (1991-01-01), Nelson
patent: 5070297 (1991-12-01), Kwon et al.
patent: 5072520 (1991-12-01), Nelson
patent: 5347159 (1994-09-01), Khandros et al.
patent: 5448014 (1995-09-01), Kong et al.
patent: 5504035 (1996-04-01), Rostoker et al.
patent: 5578874 (1996-11-01), Kurogi et al.
patent: 5610431 (1997-03-01), Martin
patent: 5705858 (1998-01-01), Tsukamoto
patent: 5872697 (1999-02-01), Christensen et al.
patent: 5952712 (1999-09-01), Ikuina et al.
patent: 5965933 (1999-10-01), Young et al.
patent: 6121676 (2000-09-01), Solberg
patent: 6140144 (2000-10-01), Najafi et al.
patent: 6225688 (2001-05-01), Kim et al.
patent: 6261945 (2001-07-01), Nye, III et al.
patent: 6279227 (2001-08-01), Khandros et al.
patent: 6326697 (2001-12-01), Farnworth
patent: 6342406 (2002-01-01), Glenn et al.
patent: 6373130 (2002-04-01), Salaville
patent: 6376279 (2002-04-01), Kwon et al.
patent: 6396470 (2002-05-01), Zhang et al.
patent: 6420208 (2002-07-01), Pozder et al.
patent: 6429511 (2002-08-01), Ruby et al.
patent: 6498381 (2002-12-01), Halahan et al.
patent: 6583444 (2003-06-01), Fjelstad
patent: 6596634 (2003-07-01), Umetsu et al.
patent: 6627864 (2003-09-01), Glenn et al.
patent: 6627985 (2003-09-01), Huppenthal et al.
patent: 6627998 (2003-09-01), Caletka et al.
patent: 6646289 (2003-11-01), Badehi
patent: 6664624 (2003-12-01), Haematsu
patent: 6674159 (2004-01-01), Peterson et al.
patent: 6693361 (2004-02-01), Siniaguine et al.
patent: 6699730 (2004-03-01), Kim et al.
patent: 6717254 (2004-04-01), Siniaguine
patent: 6753205 (2004-06-01), Halahan
patent: 6787916 (2004-09-01), Halahan
patent: 6822324 (2004-11-01), Tao et al.
patent: 6849916 (2005-02-01), Glenn et al.
patent: 2002/0089835 (2002-07-01), Simmons
patent: 2002/0090803 (2002-07-01), Salaville
patent: 2002/0102004 (2002-08-01), Minervini
patent: 2003/0025204 (2003-02-01), Sakai
patent: 2003/0052404 (2003-03-01), Thomas
patent: 2003/0067073 (2003-04-01), Akram et al.
patent: 2003/0133588 (2003-07-01), Pedersen
patent: 2003/0151139 (2003-08-01), Kimura
patent: 2003/0159276 (2003-08-01), Wakefield
patent: 2003/0168725 (2003-09-01), Warner et al.
patent: 2004/0007774 (2004-01-01), Crane, Jr. et al.
patent: 2004/0099938 (2004-05-01), Kang et al.
patent: 2004/0104261 (2004-06-01), Sterrett et al.
patent: 2004/0104470 (2004-06-01), Bang et al.
patent: 2004/0115866 (2004-06-01), Bang et al.
patent: 2004/0145054 (2004-07-01), Bang et al.
patent: 2004/0238931 (2004-12-01), Haba et al.
patent: 2004/0238934 (2004-12-01), Warner et al.
patent: 2005/0017348 (2005-01-01), Haba et al.
patent: 2005/0067681 (2005-03-01), DeVilleneuve et al.
patent: 2005/0067688 (2005-03-01), Humpston
patent: 2005/0082653 (2005-04-01), McWilliams et al.
patent: 2005/0082654 (2005-04-01), Humpston et al.
patent: 2005/0085016 (2005-04-01), McWilliams et al.
patent: 2005/0087861 (2005-04-01), Burtzlaff et al.
patent: 2005/0095835 (2005-05-01), Humpston et al.
patent: 2005/0116344 (2005-06-01), Humpston
patent: 1 071 126 (2001-01-01), None
patent: 08-213874 (1996-08-01), None
patent: WO-02/058233 (2002-07-01), None
patent: WO-2004/017399 (2004-02-01), None
patent: WO-2004/023546 (2004-03-01), None
patent: WO-2004/025699 (2004-03-01), None
U.S. Appl. No. 10/077,388, filed Feb. 15, 2002, assigned to Tessera, Inc.

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