Structure and method for metallization of semiconductor devices

Details Structure and method for metallization of semiconductor devices Structure and method for metallization of semiconductor devices

1996-06-04

1997-12-23

Niebling, John

Fishing, trapping, and vermin destroying

437192, 437194, H01L 21443

Patent

active

057007217

ABSTRACT:
A metallization alloy for semiconductor devices comprising aluminum, copper, and tungsten is provided. In a method for applying the metallization, the metal is sputtered onto a semiconductor substrate having devices formed therein. After deposition, the metallization is patterned and etched using conventional semiconductor photoresist and etch techniques.

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