Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Flip chip
Reexamination Certificate
2011-03-08
2011-03-08
Zarneke, David A (Department: 2891)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Flip chip
C257S779000, C257S753000, C257S737000, C257SE23020, C257SE23021
Reexamination Certificate
active
07902679
ABSTRACT:
A new method and package is provided for the mounting of semiconductor devices that have been provided with small-pitch Input/Output interconnect bumps. Fine pitch solder bumps, consisting of pillar metal and a solder bump, are applied directly to the I/O pads of the semiconductor device, the device is then flip-chip bonded to a substrate. Dummy bumps may be provided for cases where the I/O pads of the device are arranged such that additional mechanical support for the device is required.
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Lei Ming-Ta
Lin Chuen-Jye
Lin Mou-Shiung
McDermott Will & Emery LLP
Megica Corporation
Zarneke David A
LandOfFree
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