Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Metallic housing or support
Reexamination Certificate
2006-12-26
2006-12-26
Whitehead, Jr., Carl (Department: 2813)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Metallic housing or support
C257S796000, C257SE23133
Reexamination Certificate
active
07153725
ABSTRACT:
A method for fabricating a semiconductor package with a substrate in a strip format is provided. Semiconductor devices are attached in a strip format to the substrate, and a thermal interface material is applied to the semiconductor devices. A flat panel heat spreader is attached to each semiconductor device. The semiconductor devices are encapsulated with open encapsulation, leaving the surface of the flat panel heat spreader opposite the substrate externally exposed. Individual semiconductor packages are then singulated from the strip format.
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Alvarez Sheila Marie L.
Ararao Virgil Cotoco
Shim Il Kwon
Wang Tie
Dolan Jennifer M
Ishimaru Mikio
Jr. Carl Whitehead
ST Assembly Test Services Ltd.
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