Stress-free lead frame

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With stress relief

Reexamination Certificate

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Details

C257SE23050, C257S666000, C257S667000, C257S670000, C257S674000, C257S723000, C438S123000, C438S106000, C361S760000, C174S050510

Reexamination Certificate

active

11022071

ABSTRACT:
The present invention relates to a stress-free lead frame (1) for a semiconductor. The stress-free lead frame (1) is provided with a stress-relief means (15) and an interlocking means (16) at the outer periphery. The stress-relief means (15) is capable of accommodating expansion and compression while the interlocking means (16) take care of shock and vibration during handling to thereby eliminate delamination of the lead frame (10).

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