Stress decoupling structures for flip-chip assembly

Details Stress decoupling structures for flip-chip assembly Stress decoupling structures for flip-chip assembly

2006-11-30

2009-08-11

Clark, S. V (Department: 2823)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Flip chip

C257S786000

Reexamination Certificate

active

07573138

ABSTRACT:
A stress decoupling structure provided underneath the under-ball-metallurgy (UBM) pads of a flip-chip bonding integrated circuit (IC) chip enhances the cyclic fatigue life of the solder joints formed by the solder bumps on the IC chip. The stress decoupling structure is formed from an elastic polymer layer provided over the active surface of the integrated circuit chip. A plurality of conductive metal posts are formed in the elastic polymer layer, extending between one of the contact pads on the active surface of the chip and one of the UBM pads. Solder bumps provided on the UBM pads form the solder joints between the chip and the next level interconnect structure.

REFERENCES:
patent: 6020220 (2000-02-01), Gilleo et al.
patent: 6191952 (2001-02-01), Jimarez et al.
patent: 6399426 (2002-06-01), Capote et al.
patent: 6479900 (2002-11-01), Shinogi et al.
patent: 6597070 (2003-07-01), Miyazaki
patent: 2001/0026021 (2001-10-01), Honda
patent: 2002/0109228 (2002-08-01), Buchwalter et al.
patent: 2002/0121689 (2002-09-01), Honda
patent: 2005/0082681 (2005-04-01), Wijdenes
patent: 2006/0131746 (2006-06-01), Kohara et al.

Affiliated with

Also associated with

Rating

Stress decoupling structures for flip-chip assembly does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Stress decoupling structures for flip-chip assembly, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Stress decoupling structures for flip-chip assembly will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4067014