Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With window means
Reexamination Certificate
2005-04-12
2005-04-12
Pham, Hoai (Department: 2814)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With window means
Reexamination Certificate
active
06879030
ABSTRACT:
A strengthened window-type semiconductor package is provided. A substrate having an opening is mounted with at least a chip in a manner that, an active surface of the chip covers and partly exposed to the opening, and electrically connected to the substrate by bonding wires formed through the opening. An elastic non-conductive material is applied over the chip exclusive of the active surface. An upper encapsulant is formed to encapsulate the chip and the non-conductive material, and a lower encapsulant is formed to encapsulate the bonding wires and seal the opening. With provision of the non-conductive material for encapsulating the chip before forming the upper encapsulant, the chip can be prevented from cracking particularly at corner and edge positions that encounter relatively greater thermal stress during subsequent fabrication processes such as curing of the upper encapsulant and thermal cycles.
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patent: 6445077 (2002-09-01), Choi et al.
patent: 6555919 (2003-04-01), Tsai et al.
patent: 6601294 (2003-08-01), Jiang et al.
patent: 6614102 (2003-09-01), Hoffman et al.
patent: 20030194830 (2003-10-01), Chung
Chen Kuen-Huang
Hsu Yu-Ming
Lin Chin-Hsing
Su Wen-Sheng
Tsai Shiann-Tsong
Fulbright & Jaworski LLP
Ha Nathan W.
Pham Hoai
Ultratera Corporation
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