Metal fusion bonding – With means to juxtapose and bond plural workpieces – Wire lead bonder
Patent
1997-12-18
1999-10-26
Ryan, Patrick
Metal fusion bonding
With means to juxtapose and bond plural workpieces
Wire lead bonder
228 45, H01L 2160
Patent
active
059712481
ABSTRACT:
A rotation device (100) provides steady, non-stepwise rotation of a wire bonding capillary (10) about the longitudinal axis of the capillary (10). This enables the capillary (10) to be rotated to different angular alignments to perform wire bonding in different directions. The rotation device can include gears (111, 122) or friction pads (211, 222). At least a part (110) of the rotation device (120) is coupled to the capillary (10). Another part (120) of the rotation device (100) is separate from the capillary (10) but is engageable with the first part to provide rotation. Sensing devices (610, 620) may be used to provide precise initial alignment of the capillary (10) and to assist in providing and confirming precise alignment and realignment of the capillary to various bonding directions during wire bonding. A computer may be used to provide automated control and rotation of the sensing devices and the rotation device.
REFERENCES:
patent: 4598853 (1986-07-01), Hill
Brady III Wade James
Donaldson Richard L.
Knapp Jeffrey T.
Ryan Patrick
Texas Instruments Incorporated
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