Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Assembly of plural semiconductive substrates each possessing...
Reexamination Certificate
2006-09-28
2011-10-04
Pert, Evan (Department: 2893)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Assembly of plural semiconductive substrates each possessing...
C438S106000, C438S107000, C257S686000, C257S723000, C257S725000, C257SE25006, C257SE25025
Reexamination Certificate
active
08030134
ABSTRACT:
Stacked semiconductor assemblies in which a first die is mounted active side upward on a first substrate and is electrically interconnected to the substrate by wire bonding; an adhesive/spacer structure is formed upon the active side of the first die; and a device such as a die or a package or a heat spreader, having an electrically nonconductive side, is mounted upon the adhesive/spacer structure with the electrically nonconductive side facing the first wire bonded die. The side of the device facing the first wire bonded die may be made electrically nonconductive by having an electrically insulating layer, such as a dielectric film adhesive. Also, methods for making the assemblies are disclosed.
REFERENCES:
patent: 5140404 (1992-08-01), Fogal et al.
patent: 5218229 (1993-06-01), Farnworth
patent: 5222014 (1993-06-01), Lin
patent: 5229960 (1993-07-01), De Givry
patent: 5323060 (1994-06-01), Fogal et al.
patent: 5340771 (1994-08-01), Rostoker
patent: 5372883 (1994-12-01), Shores
patent: 5373189 (1994-12-01), Massit et al.
patent: 5436203 (1995-07-01), Lin
patent: 5444296 (1995-08-01), Kaul et al.
patent: 5495398 (1996-02-01), Takiar et al.
patent: 5550711 (1996-08-01), Burns et al.
patent: 5652185 (1997-07-01), Lee
patent: 5744863 (1998-04-01), Culnane et al.
patent: 5776799 (1998-07-01), Song et al.
patent: 5898219 (1999-04-01), Barrow
patent: 5899705 (1999-05-01), Akram
patent: 5903049 (1999-05-01), Mori
patent: 5945733 (1999-08-01), Corbett et al.
patent: 5977640 (1999-11-01), Bertin et al.
patent: 5982633 (1999-11-01), Jeansonne
patent: 5994166 (1999-11-01), Akram et al.
patent: 6025648 (2000-02-01), Takahashi et al.
patent: 6034875 (2000-03-01), Heim et al.
patent: 6075289 (2000-06-01), Distefano
patent: 6118176 (2000-09-01), Tao et al.
patent: 6133626 (2000-10-01), Hawke et al.
patent: 6157080 (2000-12-01), Tamaki et al.
patent: 6201266 (2001-03-01), Ohuchi et al.
patent: 6201302 (2001-03-01), Tzu
patent: 6238949 (2001-05-01), Nguyen et al.
patent: 6265763 (2001-07-01), Jao et al.
patent: 6265766 (2001-07-01), Moden
patent: 6274930 (2001-08-01), Vaiyapuri et al.
patent: 6316838 (2001-11-01), Ozawa et al.
patent: 6333552 (2001-12-01), Kakimoto et al.
patent: 6333562 (2001-12-01), Lin
patent: 6340846 (2002-01-01), LoBianco et al.
patent: 6351028 (2002-02-01), Akram
patent: 6376904 (2002-04-01), Haba et al.
patent: 6388313 (2002-05-01), Lee et al.
patent: 6400007 (2002-06-01), Wu et al.
patent: 6407456 (2002-06-01), Ball
patent: 6413798 (2002-07-01), Asada
patent: 6414381 (2002-07-01), Takeda
patent: 6424050 (2002-07-01), Komiyama
patent: 6436732 (2002-08-01), Ahmad
patent: 6441496 (2002-08-01), Chen et al.
patent: 6445064 (2002-09-01), Ishii et al.
patent: 6462421 (2002-10-01), Hsu et al.
patent: 6472732 (2002-10-01), Terui
patent: 6472741 (2002-10-01), Chen et al.
patent: 6472758 (2002-10-01), Glenn et al.
patent: 6489676 (2002-12-01), Taniguchi et al.
patent: 6492726 (2002-12-01), Quek et al.
patent: 6501165 (2002-12-01), Farnworth
patent: 6503821 (2003-01-01), Farquhar et al.
patent: 6512303 (2003-01-01), Moden
patent: 6538319 (2003-03-01), Terui
patent: 6545365 (2003-04-01), Kondo et al.
patent: 6545366 (2003-04-01), Michii et al.
patent: 6552423 (2003-04-01), Song et al.
patent: 6555902 (2003-04-01), Lo et al.
patent: 6569709 (2003-05-01), Derderian
patent: 6570249 (2003-05-01), Liao et al.
patent: 6583503 (2003-06-01), Akram et al.
patent: 6590281 (2003-07-01), Wu et al.
patent: 6593647 (2003-07-01), Ichikawa
patent: 6593648 (2003-07-01), Emoto
patent: 6593662 (2003-07-01), Pu et al.
patent: 6599779 (2003-07-01), Shim et al.
patent: 6607937 (2003-08-01), Corisis
patent: 6611063 (2003-08-01), Ichinose et al.
patent: 6620651 (2003-09-01), He et al.
patent: 6621169 (2003-09-01), Kikuma et al.
patent: 6621172 (2003-09-01), Nakayama et al.
patent: 6649448 (2003-11-01), Tomihara
patent: 6650009 (2003-11-01), Her et al.
patent: 6650019 (2003-11-01), Glenn et al.
patent: 6660560 (2003-12-01), Chaudhuri et al.
patent: 6667556 (2003-12-01), Moden
patent: 6690089 (2004-02-01), Uchida
patent: 6700178 (2004-03-01), Chen et al.
patent: 6706557 (2004-03-01), Koopmans
patent: 6710455 (2004-03-01), Goller et al.
patent: 6716676 (2004-04-01), Chen et al.
patent: 6734539 (2004-05-01), Degani et al.
patent: 6734552 (2004-05-01), Combs et al.
patent: 6737750 (2004-05-01), Hoffman et al.
patent: 6746894 (2004-06-01), Fee et al.
patent: 6747361 (2004-06-01), Ichinose
patent: 6753613 (2004-06-01), Levardo et al.
patent: 6762488 (2004-07-01), Maeda et al.
patent: 6777799 (2004-08-01), Kikuma et al.
patent: 6777819 (2004-08-01), Huang
patent: 6787915 (2004-09-01), Uchida et al.
patent: 6787916 (2004-09-01), Halahan
patent: 6794749 (2004-09-01), Akram
patent: 6818980 (2004-11-01), Pedron, Jr.
patent: 6828665 (2004-12-01), Pu et al.
patent: 6833287 (2004-12-01), Hur et al.
patent: 6835598 (2004-12-01), Baek et al.
patent: 6838761 (2005-01-01), Karnezos
patent: 6847105 (2005-01-01), Koopmans
patent: 6864566 (2005-03-01), Choi et al.
patent: 6882057 (2005-04-01), Hsu
patent: 6885093 (2005-04-01), Lo et al.
patent: 6890798 (2005-05-01), McMahon
patent: 6900528 (2005-05-01), Mess et al.
patent: 6906415 (2005-06-01), Jiang et al.
patent: 6906416 (2005-06-01), Karnezos
patent: 6919627 (2005-07-01), Liu et al.
patent: 6930378 (2005-08-01), St. Amand et al.
patent: 6930396 (2005-08-01), Kurita et al.
patent: 6933598 (2005-08-01), Karnezos
patent: 6951982 (2005-10-01), Chye et al.
patent: 6972481 (2005-12-01), Karnezos
patent: 7034387 (2006-04-01), Karnezos
patent: 7034388 (2006-04-01), Yang et al.
patent: 7045887 (2006-05-01), Karnezos
patent: 7049691 (2006-05-01), Karnezos
patent: 7053476 (2006-05-01), Karnezos
patent: 7053477 (2006-05-01), Karnezos
patent: 7057269 (2006-06-01), Karnezos
patent: 7061088 (2006-06-01), Karnezos
patent: 7064426 (2006-06-01), Karnezos
patent: 7071568 (2006-07-01), St. Amand et al.
patent: 7081678 (2006-07-01), Liu
patent: 7101731 (2006-09-01), Karnezos
patent: 2002/0096755 (2002-07-01), Fukui et al.
patent: 2002/0130404 (2002-09-01), Ushijima et al.
patent: 2003/0038357 (2003-02-01), Derderian
patent: 2003/0038374 (2003-02-01), Shim et al.
patent: 2003/0054162 (2003-03-01), Watson
patent: 2003/0113952 (2003-06-01), Sambasivam et al.
patent: 2003/0141582 (2003-07-01), Yang et al.
patent: 2003/0153134 (2003-08-01), Kawata et al.
patent: 2003/0178710 (2003-09-01), Kang et al.
patent: 2004/0016939 (2004-01-01), Akiba et al.
patent: 2004/0026768 (2004-02-01), Taar et al.
patent: 2004/0061213 (2004-04-01), Karnezos
patent: 2004/0195667 (2004-10-01), Karnezos
patent: 2004/0212096 (2004-10-01), Wang
patent: 2004/0222509 (2004-11-01), Ogata
patent: 2005/0090050 (2005-04-01), Shim et al.
patent: 2005/0106779 (2005-05-01), Bolken et al.
patent: 2005/0224959 (2005-10-01), Kwon et al.
patent: 2006/0043556 (2006-03-01), Su et al.
patent: 2006/0138631 (2006-06-01), Tao et al.
patent: 2006/0189033 (2006-08-01), Kim
patent: 2006/0197209 (2006-09-01), Choi et al.
patent: 05152505 (1993-06-01), None
patent: 2001223326 (2001-08-01), None
patent: 20010688614 (2001-07-01), None
patent: 2004085348 (2004-10-01), None
Lintec Semiconductor-Related Products Web Site, “Adwill Semiconductor-Related Products”, 1 page, http://www.lintec.co.jp/e-dept/english/adwill/adwill.html, downloaded Mar. 1, 2004.
Lintec Semiconductor-Related Products Web Site, “Products for Dicing Process”, 2 pages, http://www.lintec.co.jp/e-dept/english/adwill/diceproces.html, downloaded Mar. 1, 2004.
Lintec Semiconductor-Related Products Web Site, “Products for back-grinding process”, 1 page, http://www.lintec.co.jp/e-dept/english/adwill/bgproces.html, Downloaded Mar. 1, 2004.
Karnezos Marcos
Kwon Hyeog Chan
Chippac Inc.
Pert Evan
Rodela Eduardo A
LandOfFree
Stacked semiconductor package having adhesive/spacer... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Stacked semiconductor package having adhesive/spacer..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Stacked semiconductor package having adhesive/spacer... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-4303140