Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Chip mounted on chip
Reexamination Certificate
2006-07-04
2006-07-04
Clark, Jasmine (Department: 2815)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Chip mounted on chip
C257S783000, C257S786000, C438S109000
Reexamination Certificate
active
07071568
ABSTRACT:
A structure includes a substrate having a first surface, a first semiconductor die, a spacer and a second semiconductor die. The first semiconductor die has an active surface with opposite first and second parallel rows of bond pads, and an opposite inactive surface attached to the first surface of the substrate. The spacer is coupled to the active surface of the first semiconductor die entirely within the first and second rows of bond pads of the first semiconductor die, the spacer overhanging at least one side of the first semiconductor die. The second semiconductor die has an active surface and an opposite inactive surface, the active surface of the second semiconductor die larger in area than the active surface of the first semiconductor die, the active surface of the second semiconductor die with at least one row of bond pads.
REFERENCES:
patent: 5291061 (1994-03-01), Ball
patent: 5323060 (1994-06-01), Fogal et al.
patent: 5502289 (1996-03-01), Takiar et al.
patent: 5721452 (1998-02-01), Fogal et al.
patent: 5815372 (1998-09-01), Gallas
patent: 5886412 (1999-03-01), Fogal et al.
patent: 5963794 (1999-10-01), Fogal et al.
patent: 6005778 (1999-12-01), Spielberger et al.
patent: 6051886 (2000-04-01), Fogal et al.
patent: 6100594 (2000-08-01), Fukui et al.
patent: 6215193 (2001-04-01), Tao et al.
patent: 6448659 (2002-09-01), Lee
patent: 6633086 (2003-10-01), Peng et al.
patent: 6664644 (2003-12-01), Morozumi
patent: 6714418 (2004-03-01), Frankowsky et al.
patent: 6744141 (2004-06-01), Kimura
patent: 6750545 (2004-06-01), Lee et al.
patent: 2002/0096785 (2002-07-01), Kimura
patent: 2003/0011067 (2003-01-01), Kimura
patent: 2003/0038374 (2003-02-01), Shim et al.
patent: 2004/0016939 (2004-01-01), Akiba et al.
patent: 2004/0037059 (2004-02-01), Stiborek et al.
patent: 2004/0053442 (2004-03-01), Akram et al.
patent: 2004/0075164 (2004-04-01), Pu et al.
patent: 2004/0126926 (2004-07-01), Arai et al.
patent: 60182731 (1985-09-01), None
patent: 63128736 (1988-06-01), None
Kim In-Tae
Perelman Vladimir
St. Amand Roger D.
Amkor Technology Inc.
Clark Jasmine
Gunnison McKay & Hodgson, L.L.P.
Hodgson Serge J.
LandOfFree
Stacked-die extension support structure and method thereof does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Stacked-die extension support structure and method thereof, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Stacked-die extension support structure and method thereof will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3603932