4. Semiconductor device manufacturing: process
  5. Making field effect device having pair of active regions...
  6. Having insulated gate

Roger D. St. Amand

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Flip chip bump structure and fabrication method

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate

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Functional pathway configuration at a system/IC interface

Electronic digital logic circuitry – Interface – Logic level shifting
Reexamination Certificate

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Method of forming narrow thermal silicon dioxide side isolation

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having insulated gate
Patent

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Package in package device for RF transceiver module

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Reexamination Certificate

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Semiconductor package with fast power-up cycle and method of...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Chip mounted on chip
Reexamination Certificate

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Profile ID: LFUS-PAI-P-197855

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