Stackable ceramic FBGA for high thermal applications

Details Stackable ceramic FBGA for high thermal applications Stackable ceramic FBGA for high thermal applications

2005-02-22

2005-02-22

Nelms, David (Department: 2818)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Multiple housings

C257S698000

Reexamination Certificate

active

06858926

ABSTRACT:
An apparatus package for high-temperature thermal applications for ball grid array semiconductor devices and a method of packaging ball grid array semiconductor devices.

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