Metal fusion bonding – Process – Diffusion type
Patent
1995-06-05
1997-01-21
Heinrich, Samuel M.
Metal fusion bonding
Process
Diffusion type
22826271, B23K 2000, B23K 2022, C23C 1434
Patent
active
055953379
ABSTRACT:
A target, target backing plate, and cover plate form a target plate assembly. The sputtering target assembly includes an integral cooling passage. A series of grooves are constructed in either the target backing plate or the target backing cooling cover plate, which are then securely bonded to one another. The sputtering target can be a single monolith with a target backing plate or can be securely attached to the target backing plate by one of any number of conventional bonding methods. Tantalum to titanium, titanium to titanium and aluminum to titanium, diffusion bonding can be used.
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Berkstresser David E.
Demaray Richard E.
Herrera Manuel
Applied Materials Inc.
Biksa Janis
Heinrich Samuel M.
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