Chemistry: electrical and wave energy – Processes and products – Coating – forming or etching by sputtering
Patent
1992-08-27
2000-02-15
Nguyen, Nam
Chemistry: electrical and wave energy
Processes and products
Coating, forming or etching by sputtering
20429818, 20429819, 2042982, 20429821, 20429822, C23C 1434
Patent
active
060248432
ABSTRACT:
A magentron sputtering apparatus includes a rotatable magnet which is either concave or convex. For one magnet structure, at least a portion of the centerline of the magnet lies along a curve defined by ##EQU1## where .xi.(r) is a preselected erosion profile. When stationary, the magnet generates a localized magnetic field of approximately constant width. In operation, when the magnet is rotated, it generates the preselected erosion profile in the target. The preselected erosion profile may be constant.
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Anderson Robert L.
Helmer John C.
Nguyen Nam
Novellus Systems Inc.
Tso Roland
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