Sputtering apparatus, method of operating the same, and...

Chemistry: electrical and wave energy – Processes and products – Coating – forming or etching by sputtering

Reexamination Certificate

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Details

C204S298250, C204S298260, C204S298120

Reexamination Certificate

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08052850

ABSTRACT:
A sputtering apparatus includes a susceptor for receiving a substrate, and a first target device disposed to be opposite to a center region of a substrate and at least second and third target devices disposed to be opposite to peripheral regions of the substrate, wherein the second and third target devices are rotatable.

REFERENCES:
patent: 6290826 (2001-09-01), Obinata et al.
patent: 6336999 (2002-01-01), Lemmer et al.
patent: 2004/0231973 (2004-11-01), Sato et al.
patent: 2005/0252768 (2005-11-01), Bangert et al.
patent: 1693532 (2005-11-01), None

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