Sputtering apparatus for improved step coverage

Details Sputtering apparatus for improved step coverage Sputtering apparatus for improved step coverage

1997-07-08

1999-11-09

McDonald, Rodney

Chemistry: electrical and wave energy

Processes and products

Coating, forming or etching by sputtering

20429811, C23C 1434

Patent

active

059807024

ABSTRACT:
A sputtering apparatus includes a target that is sputtered to deposit a material layer on a substrate. A filtering member is disposed intermediate the substrate and target to prevent target material particles travelling perpendicular to the substrate from contacting the substrate. This filtering reduces the rate of deposition occurring on the surface of the substrate with respect to that occurring on the walls of any holes therein, and thereby increases the deposition layer forming on the wall of the hole with respect to that forming on the surface of the substrate and base of the hole.

REFERENCES:
patent: 4508612 (1985-04-01), Blackwell et al.
patent: 4704306 (1987-11-01), Nakamura
patent: 4988424 (1991-01-01), Woodward et al.
patent: 5223108 (1993-06-01), Hurwitt
patent: 5344352 (1994-09-01), Horne et al.
patent: 5643428 (1997-07-01), Krivokapic et al.
IBM Technical Disclosure Bulletin, Anonymous "Improvement of Uniformity of Through--Hole Coverage", vol. 30, No. 4, Sep. 1987.

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