Sputtering apparatus and method

Details Sputtering apparatus and method Sputtering apparatus and method

1995-07-20

1997-05-06

Weisstuch, Aaron

Chemistry: electrical and wave energy

Processes and products

Coating, forming or etching by sputtering

20429816, 20429818, 20429819, C23C 1435

Patent

active

056267274

ABSTRACT:
A sputtering apparatus uses a plurality of rectangular targets to form a thin film on a substrate, and includes a plurality of magnets disposed along both side edges of each target in such a manner that the polarities of adjacent magnets along the side edges of the targets are opposite, and polarities of the magnets confronting each other across the targets are opposite. The surfaces of at least two targets are inclined to a surface of the substrate at an angle not smaller than 30.degree. and not larger than 60.degree..

REFERENCES:
patent: 5403457 (1995-04-01), Nago et al.

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