Sputter target design

Details Sputter target design Sputter target design

1990-05-17

1991-04-23

Nguyen, Nam X.

Chemistry: electrical and wave energy

Apparatus

Coating, forming or etching by sputtering

20429809, C23C 1434

Patent

active

050097652

ABSTRACT:
A cathode sputtering assembly includes a sputter target welded to a corresponding backing member, where the target and backing member are adapted for insertion into a sputtering system. The target has a reduced diameter portion profiled for receipt within a counterbored upper section of the backing member. The target has a beveled surface above the reduced diameter section, and the backing member has an upper tapered edge, where the interface between the sputtering target and the backing member cooperate to define a V-groove. Both the target and the backing member are comprised of aluminum and the target and backing member are TIG welded together with aluminum filler rod.

REFERENCES:
patent: 3749662 (1973-07-01), Biehl
patent: 4014779 (1977-03-01), Kuehnle
patent: 4100055 (1978-07-01), Rainey
patent: 4169031 (1979-09-01), Brors
patent: 4324631 (1982-04-01), Meckel et al.
patent: 4385979 (1983-05-01), Pierce et al.
patent: 4457825 (1984-07-01), Lamont, Jr.
patent: 4657654 (1987-04-01), Mintz
patent: 4826584 (1989-05-01), Ribeiro
C. Elphick, "The construction . . . use", Vacuum, vol. 31, pp. 5-7, 1981.

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