Semiconductor device manufacturing: process – Coating of substrate containing semiconductor region or of... – Insulative material deposited upon semiconductive substrate
Patent
1998-09-03
2000-10-31
Niebling, John F.
Semiconductor device manufacturing: process
Coating of substrate containing semiconductor region or of...
Insulative material deposited upon semiconductive substrate
427240, 118 52, H01L 2131
Patent
active
061402532
ABSTRACT:
Methods are disclosed for processing a semiconductor wafer. The methods may include removing first and second amounts of liquid from the lower surface of the wafer. The subject invention may also comprise methods for removing a liquid from a semiconductor wafer surface that include contacting the semiconductor wafer surface with an annular barrier formed in a ring member and draining the liquid contacting the annular barrier from the ring member. Other methods are disclosed for applying a solvent to a surface coating to remove excess therefrom and draining the solvent and liquid from a wafer support member.
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Hayes Bruce L.
Montanino Greg
Lattin Christopher
Micro)n Technology, Inc.
Niebling John F.
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