Specimen or substrate cutting method using focused charged parti

Details Specimen or substrate cutting method using focused charged parti Specimen or substrate cutting method using focused charged parti

1988-10-05

1990-07-03

Berman, Jack I.

Radiant energy

Inspection of solids or liquids by charged particles

Positive ion probe or microscope type

250288, 2504922, 2504923, H01J 37305

Patent

active

049393642

ABSTRACT:
A specimen or substrate cutting method of cutting or processing a predetermined portion of a specimen or substrate in a direction of depth thereof by generating a focused charged particle beam from a particle beam source and irradiating the predetermined portion of the specimen or substrate with the focused charged particle beam is disclosed in which a particle species of the charged particle beam is selected such that each of the melting point of the particle species itself and the melting point of an alloy or compound of the particle species and constituent atoms of the specimen or substrate is not lower than 3/2 times of the temperature of the specimen or substrate in units of absolute temperature. A secondary ion mass-spectroscopic analysis method is also disclosed in which the charged particle beam is used as a probe to mass-analyze secondary charged ion successively generated from the cut portion of the specimen or substrate.

REFERENCES:
patent: 4367429 (1983-01-01), Wang et al.
patent: 4687930 (1987-08-01), Tamura et al.
Melngailis et al., J. Vac. Sci. Technol. B4(1), Jan./Feb., 1986, pp. 176-180.

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