Spacing control in electronic device assemblies

Details Spacing control in electronic device assemblies Spacing control in electronic device assemblies

1995-01-27

1997-05-27

Whitehead, Jr., Carl

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Flip chip

257738, 257779, 257780, H01L 2348, H01L 2352, H01L 2940

Patent

active

056335350

ABSTRACT:
A method of forming standoff spacer pedestals on a device above the substrate by supporting the electronic device with the standoff spacer pedestals during solder reflow and bonding. Generally, the method comprising the steps of adhering at least one layer of film solder resist on the substrate, and eliminating the undesired portions of dry film solder resist to form the pedestals.

REFERENCES:
patent: 4927697 (1990-05-01), Hill
patent: 4967950 (1990-11-01), Legg et al.
patent: 5056215 (1991-10-01), Blanton
patent: 5130779 (1992-07-01), Agarwala et al.
patent: 5154341 (1992-10-01), Melton et al.
patent: 5218234 (1993-06-01), Thompson et al.
patent: 5448114 (1995-09-01), Kondoh et al.

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