Spacer structure as transistor gate

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having insulated gate

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438304, 438305, 438596, H01L 21336

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active

061241741

ABSTRACT:
A semiconductor process includes forming a spacer support structure on an upper surface of a semiconductor substrate. The semiconductor substrate includes a channel region that is laterally displaced between first and second source/drain regions. A. The spacer support structure includes a substantially vertical sidewall that is laterally aligned over a boundary between the first source/drain region and the channel region of the semiconductor substrate. A gate dielectric is then grown and a transistor gate fabricated by forming a first spacer structure on the sidewall of the spacer support structure. The first spacer structure includes a substantially vertical first sidewall in contact with the spacer support structure sidewall and further includes a second sidewall that is laterally aligned over a boundary between the channel region and the second source/drain region of the semiconductor substrate. The spacer support structure is then removed and source/drain impurity distributions are introduced into the source/drain regions of the semiconductor substrate.

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