Solid-state imaging device and method for manufacturing the...

Radiant energy – Photocells; circuits and apparatus – Photocell controlled circuit

Reexamination Certificate

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C257S676000, C257S693000, C348S340000, C438S106000

Reexamination Certificate

active

06897428

ABSTRACT:
A solid-state imaging device includes: a housing having a base and a rectangular-frame-shaped rib that are resin molded integrally; metal lead pieces embedded in the housing, each of which has an internal terminal portion facing an internal space, an external terminal portion exposed on a bottom face, and a side electrode portion exposed on an external side face; an imaging element fixed on the base; connection members connecting electrodes of the imaging element and the internal terminal portions of the metal lead pieces, respectively; and a transparent plate fixed on an upper end face of the rib. A thickness of each metal lead piece at a position of its internal terminal portion is substantially equal to a thickness of the base, and the external terminal portion is formed with a reverse face of the metal lead piece at a position corresponding to the internal terminal portion. In the resin molding, the internal terminal portion is pressed against the upper mold, whereby the occurrence of resin burrs is suppressed.

REFERENCES:
patent: 4594613 (1986-06-01), Shinbori et al.
patent: 20040212717 (2004-10-01), Minamio et al.
patent: 2001-77277 (2001-03-01), None

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