Solid-state imaging device and method for manufacturing the...

Details Solid-state imaging device and method for manufacturing the... Solid-state imaging device and method for manufacturing the...

2007-11-13

2007-11-13

Louie, Wai-Sing (Department: 2814)

Active solid-state devices (e.g., transistors, solid-state diode

Physical configuration of semiconductor

With electrical contact in hole in semiconductor

C257S667000, C257S774000

Reexamination Certificate

active

10876839

ABSTRACT:
A solid-state imaging device includes a housing having a resin-molded base and ribs; metal lead pieces embedded in the housing, the metal lead pieces each having an inner terminal portion facing an inner space of the housing, an outer terminal portion exposed at a bottom surface of the housing, and a lateral electrode portion exposed at an outer lateral surface of the housing; an imaging element fixed on the base in the inner space; connecting members connecting electrodes of the imaging element respectively to the inner terminal portions; and a transparent plate fixed to an upper surface of the ribs. The die pad having a through hole is embedded in a center portion of the base so that the die pad's upper and lower surfaces are exposed, and the imaging element is fixed on the die pad. A ventilation hole to the inner space of the housing that is formed in one piece with a resin can be formed easily with a simple configuration.

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patent: 2003-152123 (2003-05-01), None

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