Solders with intermetallic phases, solder bumps made...

Details Solders with intermetallic phases, solder bumps made... Solders with intermetallic phases, solder bumps made...

2005-06-30

2009-08-25

Wyszomierski, George (Department: 1793)

Alloys or metallic compositions

Gallium, indium, or thallium base

Reexamination Certificate

active

07578966

ABSTRACT:
A solder composition includes a reflow-wetting element that is an intermetallic both pre-reflow and post-reflow. The intermetallic releases the reflow-wetting element upon heating. The solder composition includes the intermetallic first phase in a bulk-solder second phase. A method of assembling a microelectronic package includes the intermetallic in a solder. A computing system also includes the intermetallic first phase in the bulk-solder second phase.

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