4. Inductor devices
  5. Coil or coil turn supports or spacers
  6. Printed circuit-type coil

Daewoong Suh

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Bulk metallic glass solder material

Metal treatment – Stock – Amorphous – i.e. – glassy
Reexamination Certificate

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Forming a semiconductor package including a thermal...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Reexamination Certificate

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Inductor using bulk metallic glass material

Inductor devices – Coil or coil turn supports or spacers – Printed circuit-type coil
Reexamination Certificate

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Intermetallic solder with low melting point

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum
Reexamination Certificate

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Methods and apparatuses for providing stacked-die devices

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Assembly of plural semiconductive substrates each possessing...
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2239949

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