Solder pads for improving reliability of a package

Details Solder pads for improving reliability of a package Solder pads for improving reliability of a package

2005-09-06

2005-09-06

Pham, Hoai (Department: 2814)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Flip chip

C257S686000, C257S723000

Reexamination Certificate

active

06940176

ABSTRACT:
Solder pads for improving reliability of a semiconductor package are provided. The package includes a substrate and/or a chip. The solder pad includes a plurality of first solder pads located on a surface of the substrate and/or the chip, and at least a second solder pad located on a predetermined region of the surface of the substrate and/or the chip. Each of the first solder pads has a first diameter. The second solder pad has a second diameter greater than the first diameter so as to sustain a stronger thermal stress on the substrate and/or the chip.

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