Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Insulative housing or support
Reexamination Certificate
2006-03-28
2006-03-28
Lebentritt, Michael (Department: 2812)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Insulative housing or support
C438S118000, C438S106000
Reexamination Certificate
active
07018871
ABSTRACT:
A carrier substrate includes at least one die-attach location and one or more terminals that protrude from a surface of the carrier substrate so as to prevent adhesive material from contaminating connection surfaces thereof. A solder mask for use on a carrier substrate includes a device-securing region positionable over at least a portion of a die-support location of the carrier substrate. Dams of the solder mask are positionable laterally adjacent to at least portions of the peripheries of corresponding terminals of the carrier substrate. The carrier substrate and solder mask may each include one or more recessed areas that laterally surround at least portions of their die-attach location and device-securing region, respectively, to receive some of the excess adhesive. Assemblies and packages including one or both of the carrier substrate and solder mask are also disclosed, as are assembly methods and methods for designing the carrier substrate and solder mask.
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Webpage, Objet Prototyping the Future, “Objet FullCure700 Series”,1 page.
Webpage, Objet Prototyping the Future, “How it Works”, 2 pages.
Lee Choon Kuan
Lee Kian Chai
Lim Guek Har
Poh Cheng Pour
Poh Teck Huat
Lebentritt Michael
Stevenson André
TraskBritt
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