Solder interconnection structure

Details Solder interconnection structure Solder interconnection structure

1991-07-30

1993-10-05

Hille, Rolf

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Flip chip

257687, 257786, 257793, 2281801, 22818022, 4284111, 4284228, 525107, 525122, 528210, 528211, 528422, 361765, H01L 2348, H01L 2940, H01L 2964, H01L 3902

Patent

active

052508480

ABSTRACT:
Solder interconnection whereby the gap created by solder connections between a carrier substrate and semiconductor device is filled with a composition obtained from curing a preparation containing a cycloaliphatic polyepoxide and/or curable cyanate ester or prepolymer thereof; filler having a maximum particle size of 31 microns and being at least substantially free of alpha particle emissions.

REFERENCES:
patent: 3949125 (1976-04-01), Roberts
patent: 4199412 (1980-04-01), Battaglia et al.
patent: 4504283 (1985-03-01), Charvat
patent: 4579806 (1986-04-01), Schupp et al.
patent: 4604644 (1986-08-01), Beckham et al.
patent: 4740584 (1988-04-01), Shimp
patent: 4999699 (1991-03-01), Christie et al.
patent: 5089440 (1992-02-01), Christie et al.
patent: 5121190 (1992-06-01), Hsiao et al.
Chemical Abstracts, 164236A, vol. 82, 1975, p. 573.

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