Solder foams, nano-porous solders, foamed-solder bumps in...

Details Solder foams, nano-porous solders, foamed-solder bumps in... Solder foams, nano-porous solders, foamed-solder bumps in...

2005-12-30

2010-06-29

McNeil, Jennifer C (Department: 1794)

Stock material or miscellaneous articles

All metal or with adjacent metals

Porous

C428S570000, C428S929000, C257S772000, C228S056300

Reexamination Certificate

active

07745013

ABSTRACT:
A foamed solder or a nano-porous solder is formed on a substrate of an integrated circuit package. The foamed solder exhibits a low modulus that resists cracking during shock and dynamic loading. The foamed solder is used as a solder bump for communication between an integrated circuit device and external structures.

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Office Action Received for Taiwan Patent Application No. 95146349, mailed on Aug. 20, 2009, 2 pages of Taiwan Office Action and English Translation 4 pages.

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