Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Solder wettable contact – lead – or bond
Reexamination Certificate
2006-06-06
2006-06-06
Lee, Eddie (Department: 2811)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Solder wettable contact, lead, or bond
C257S737000, C257S738000, C257S778000, C257S780000, C257S690000, C257S773000
Reexamination Certificate
active
07057292
ABSTRACT:
A solder bar compatible with conventional flip chip technology fabrication methods for high power/high current applications includes first and second generally circular solder pads of diameter D formed upon a substrate and connected by a solder bar pad of width BW. The centers of the generally circular solder pads are spaced apart by distance BL (bar length). A mass of solder having volume VB is formed over the first and second generally circular solder pads and over the solder bar pad to form a dog-bone shaped solder bar. The solder bar reaches height H1above the centers of the first and second generally circular solder pads, and reaching height H2above the midpoint of the solder bar pad. The values for diameter D, bar length BL, bar width BW, and solder volume VB are selected in such manner that H1and H2are approximately equal. Conventional circular (as viewed from above) solder bumps can be formed upon the same substrate; in this case, heights H1and H2are made approximately equal to the height of the conventional solder bumps.
REFERENCES:
patent: 4605153 (1986-08-01), Van Den Brekel et al.
patent: 5011066 (1991-04-01), Thompson
patent: 5220200 (1993-06-01), Blanton
patent: 5261593 (1993-11-01), Casson et al.
patent: 5302854 (1994-04-01), Nishiguchi et al.
patent: 5367435 (1994-11-01), Andros et al.
patent: 5453582 (1995-09-01), Amano et al.
patent: 5547740 (1996-08-01), Higdon et al.
patent: 5564617 (1996-10-01), Degani et al.
patent: 5567648 (1996-10-01), Gupta
patent: 5661831 (1997-08-01), Sasaki et al.
patent: 5796169 (1998-08-01), Dockerty et al.
patent: 6050832 (2000-04-01), Lee et al.
patent: 6091155 (2000-07-01), Jonaidi
patent: 6118182 (2000-09-01), Barrow
patent: 6239488 (2001-05-01), Chen
Brakke, Kenneth A., Mathematics Department, Susquehanna University, Selinsgrove, PA 17870, excerpts from the Web site for “The Surface Evolver”, Version 2.14, dated Aug. 18, 1999, including Surface Evolver Overview; Surface Evolver Documentation: Example: Column of Liquid Solder; Newsletter No. 2 (Feb. 26, 1993); and Newsletter No. 8 (Jun. 23, 1994).
Brandenburg, Scott and Yeh, Shing, “Electromigration Studies Of Flip Chip Bump Solder Joints”,Proceedings Surface Mount International 1998, Sep. 1998.
Elenius Peter
Yang Hong
FlipChip International LLC
Lee Eddie
Parekh Nitin
LandOfFree
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